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Title:
SILICON CHAIN-CONTAINING LOW-TEMPERATURE-RESISTANT FLEXIBLE POLYURETHANE PHOTOSENSITIVE RESIN COMPOSITION FOR PHOTOCURING 3D PRINTING AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/050529
Kind Code:
A1
Abstract:
A silicon chain-containing low-temperature-resistant flexible polyurethane photosensitive resin composition for photocuring 3D printing and a preparation method therefor. The composition comprises the following raw materials in parts by weight: 30-80 parts of a silicon chain-containing low-temperature-resistant flexible polyurethane prepolymer, 5-10 parts of polyurethane acrylate resin, 35-70 parts of a reactive diluent, 1.0-5.0 parts of a photoinitiator, and 0.1-1.0 part of an antioxidant. The silicon chain-containing low-temperature-resistant flexible polyurethane photosensitive resin composition has higher reaction activity, can be used for conventional SLA, DLP, LCD and other desktop-level 3D printing devices, and moreover, a printed product contains a silicon chain, and is good in low-temperature resistance, small in shrinkage rate, resistant to aging and excellent in mechanical property.

Inventors:
ZHUO DONGXIAN (CN)
CHEN SHAOYUN (CN)
LUO YONGQIANG (CN)
CHEN MIAOMIAO (CN)
QU BO (CN)
WANG RUI (CN)
ZHENG YANYU (CN)
LIU XIAOYING (CN)
LI WENJIE (CN)
HUANG HUILING (CN)
XU YIHAO (CN)
Application Number:
PCT/CN2021/128717
Publication Date:
April 06, 2023
Filing Date:
November 04, 2021
Export Citation:
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Assignee:
UNIV QUANZHOU NORMAL (CN)
International Classes:
C08F283/00; B33Y70/00; C08F220/20; C08F220/28
Domestic Patent References:
WO2021180591A12021-09-16
WO2012108193A12012-08-16
Foreign References:
CN113105590A2021-07-13
CN113045709A2021-06-29
CN113388073A2021-09-14
JP2011184588A2011-09-22
Attorney, Agent or Firm:
FUZHOU JUNCHENG ZHISHICHANQUAN DAILI YOUXIANGONGSI (CN)
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