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Title:
LOW-TOUGHNESS WORKPIECE CUTTING DEVICE, LOW-TOUGHNESS WORKPIECE MANUFACTURING METHOD, AND RECORDING MEDIUM THAT STORES LOW-TOUGHNESS WORKPIECE MANUFACTURING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/181865
Kind Code:
A1
Abstract:
Provided are a low-toughness workpiece cutting device, a low-toughness workpiece manufacturing method, and a low-toughness workpiece manufacturing program that are for predicting the occurrence and/or non-occurrence of defects, prior to subjecting a low-toughness material to a cutting process. A defect prediction device comprises a storage device, a calculation device, and an interface. The storage device stores tool data indicating the shape and physical properties of a tool, cutting data indicating a group of parameters for cutting that is to be performed on a workpiece using the tool, and material data indicating the shape and physical properties of the workpiece. On the basis of the tool data, the cutting data, and the material data, the calculation device performs an analysis of deformation of the workpiece that is associated with cutting force, and an analysis of fracturing of the workpiece that is associated with said deformation, and predicts the occurrence and/or non-occurrence of defects in the workpiece due to cutting. The interface outputs the result of the prediction.

Inventors:
NAIKI YUKIO (JP)
NAGAMI SHIRO (JP)
MATSUNAGA KEIGO (JP)
MIZUTANI KOJI (JP)
SHAMOTO EIJI (JP)
HAYASAKA TAKEHIRO (JP)
YOSHINO SHOTA (JP)
Application Number:
PCT/JP2021/001238
Publication Date:
September 16, 2021
Filing Date:
January 15, 2021
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
MITSUBISHI HEAVY IND AERO ENGINES LTD (JP)
NATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM (JP)
International Classes:
G05B19/18; B23Q15/00; G05B19/4069
Foreign References:
JP3916260B22007-05-16
JPH09264815A1997-10-07
JP2003019646A2003-01-21
JP2018202551A2018-12-27
JPH09264815A1997-10-07
JP2020042572A2020-03-19
Attorney, Agent or Firm:
KARINO Yoshimasa (JP)
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