Title:
METHOD FOR Sn-ALLOY ELECTROLYTIC PLATING AND Sn-ALLOY ELECTROLYTIC PLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2013/122046
Kind Code:
A1
Abstract:
Provided is a method for Sn-alloy electrolytic plating that allows use of a soluble anode in resolving the problem of metal deposition on an anode when an Sn alloy such as a Sn-Ag alloy is electrolytically plated. The interior of a plating tank (1) is divided into a cathode chamber (4) and an anode chamber (3) by an anion conversion membrane (2), a Sn-ion-containing plating solution is supplied to the cathode chamber (4) and an acid solution is supplied to the anode chamber (3). The gap between an object to be plated (12) in the cathode chamber (4) and a Sn anode (11) in the anode chamber (3) is electrified to perform electrolytic plating, and the acid solution containing Sn ions eluting from the Sn anode (11) as plating progresses is used as an Sn-ion resupply liquid for the plating solution in the cathode chamber (4).
Inventors:
HATTA TAKESHI (JP)
MASUDA AKIHIRO (JP)
MASUDA AKIHIRO (JP)
Application Number:
PCT/JP2013/053248
Publication Date:
August 22, 2013
Filing Date:
February 12, 2013
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D17/00; C25D21/14
Foreign References:
| JP2005139474A | 2005-06-02 |
Attorney, Agent or Firm:
AOYAMA, MASAKAZU (JP)
Aoyama Masakazu (JP)
Aoyama Masakazu (JP)
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