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Title:
MACHINE LEARNING DEVICE, AIR CONDITIONING SYSTEM, AND MACHINE LEARNING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/218563
Kind Code:
A1
Abstract:
Provided is a machine learning device that optimizes the movement of a quantity of heat. The machine learning device learns the temperature and/or the flow rate when a heat conveyance device conveys a heat medium, in an air conditioning system including a heat supply-side device, a heat use-side device, and the heat conveyance device which conveys the heat medium from the heat supply-side device to the heat use-side device. The machine learning device includes: a state variable acquisition unit that acquires a state variable including an operation condition of the heat supply-side device, an operation condition of the heat use-side device, and a value correlated to the quantity of heat required by the heat use-side device; a learning unit that learns by associating the state variable and at least one of the temperature and the flow rate; and a remuneration calculation unit that calculates a remuneration on the basis of the total value of the consumed power of the heat supply-side device, the consumed power of the heat use-side device, and the consumed power of the heat conveyance device. The learning unit learns by using the remuneration.

Inventors:
FUJITA NAOTOSHI (JP)
NAKAYAMA HIROSHI (JP)
OKAMOTO YASUNORI (JP)
Application Number:
PCT/JP2020/017806
Publication Date:
October 29, 2020
Filing Date:
April 24, 2020
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
International Classes:
F24F3/153; F24F5/00; F24F11/46; F24F11/62; F24F11/83; G06N20/00; F24F110/10; F24F110/20; F24F140/20
Foreign References:
JP2008256258A2008-10-23
JP2019002591A2019-01-10
JP2017142595A2017-08-17
JP2012127573A2012-07-05
JP2019026103A2019-02-21
JP2004293844A2004-10-21
JP2004053127A2004-02-19
JP2018173221A2018-11-08
JP2019086781A2019-06-06
JP2019086782A2019-06-06
JP2019086785A2019-06-06
Other References:
See also references of EP 3961114A4
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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