Title:
MACHINING CONDITION SEARCHING DEVICE AND MACHINING CONDITION SEARCHING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/186521
Kind Code:
A1
Abstract:
A machining condition searching device (1) is provided with: a machining condition generation unit (11) that generates a machining condition to be set in a machining device (2); a machining state collection unit (12) that collects a machining state; a machining result collection unit (13) that collects the machining result of machining performed according to the machining condition; a machining result evaluation unit (14) that calculates an evaluation value of the machining on the basis of the machining result; an evaluation value prediction model (16) that predicts, on the basis of the machining condition, the machining state, and the evaluation value, an evaluation value corresponding to an untried machining condition; and a model construction unit (15) that constructs an evaluation value prediction model (16) on the basis of the degree of change in the relation between the aforementioned machining condition and the evaluation value, and performs weighting in the evaluation value prediction model (16) according to the machining state. The machining condition generation unit (11) uses the predicted evaluation value to generate a next machining condition to be tried, and until it is determined that searching is to be terminated, the individual processing steps are repeatedly performed by the machining state collection unit (12), the machining result collection unit (13), the machining result evaluation unit (14), the evaluation value prediction model (16), and the model construction unit (15).
Inventors:
MASUI HIDEYUKI (JP)
YOSHIKAWA HIROSHI (JP)
MARUTA JUN (JP)
NAKANE KOKI (JP)
NAKAGAWA TAKAYUKI (JP)
YOSHIKAWA HIROSHI (JP)
MARUTA JUN (JP)
NAKANE KOKI (JP)
NAKAGAWA TAKAYUKI (JP)
Application Number:
PCT/JP2020/011587
Publication Date:
September 23, 2021
Filing Date:
March 17, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G05B19/4155; B23Q15/00
Domestic Patent References:
| WO2019202672A1 | 2019-10-24 |
Foreign References:
| JP6639760B1 | 2020-02-05 | |||
| JP2019067137A | 2019-04-25 | |||
| JP2018111145A | 2018-07-19 | |||
| JP2012236267A | 2012-12-06 |
Attorney, Agent or Firm:
TAZAWA, Hideaki et al. (JP)
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