Title:
MAGNETIC COMPOSITE
Document Type and Number:
WIPO Patent Application WO/2023/189359
Kind Code:
A1
Abstract:
Provided is a magnetic composite comprising a dense and relatively thick ferrite layer demonstrating excellent adhesion and effect of reducing magnetic loss at high frequencies, the magnetic composite also having excellent heat resistance. This magnetic composite comprises a non-metallic inorganic base material and a ferrite layer provided on the surface of the non-metallic inorganic base material. The non-metallic inorganic base material has a thickness (dM) of 2.0 μｍ or greater. The ferrite layer has a thickness (dF) between 2.0 μｍ and 50.0 μｍ and mainly comprises spinel ferrite. Also, the ferrite layer has an α-Fe2O3 content between 3.0% and 25.0% by mass.
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Inventors:
ISHII KAZUTAKA (JP)
AGA KOJI (JP)
AGA KOJI (JP)
Application Number:
PCT/JP2023/009083
Publication Date:
October 05, 2023
Filing Date:
March 09, 2023
Export Citation:
Assignee:
POWDERTECH CO LTD (JP)
International Classes:
H01F10/20; C04B35/26; H05K9/00
Foreign References:
| JP2007174462A | 2007-07-05 | |||
| JP2003297628A | 2003-10-17 |
Attorney, Agent or Firm:
SEKIGUCHI Masao (JP)
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