MAGNETIC DIELECTRIC RESIN COMPOSITION AND APPLICATION THEREOF

WIPO Patent Application WO/2022/088248

A1

Provided are a magnetic dielectric resin composition and an application thereof, the magnetic dielectric resin composition comprising resin and a magnetic filler, the magnetic filler being a composition of a positive temperature drift coefficient magnetic filler and a negative temperature drift coefficient magnetic filler. By means of the synergistic cooperation of two magnetic fillers, the magnetic dielectric resin composition, in one aspect, has a larger magnetic permeability and reduces magnetic loss and, in another aspect, may reduce the temperature drift coefficient and improve stability, such that same is suitable for the preparation of prepreg materials, laminates, copper clad laminates and printed circuits. A copper clad laminate that comprises the magnetic dielectric resin composition has the features of high relative magnetic permeability, low magnetic loss and a low temperature drift coefficient, and has good performance stability, and may fully satisfy requirements for applying a copper clad laminate in the preparation of a high-performance and miniaturized electronic product.

YIN WEIFENG (CN)
ZHANG JIMING (CN)
SHI JIANYING (CN)
ZHANG JIANGLING (CN)
LI SHA (CN)
CHAI SONGGANG (CN)
XU YONGJING (CN)
LIU QIANFA (CN)
HUO CUI (CN)

PCT/CN2020/127789

May 05, 2022

November 10, 2020

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SHENGYI TECHNOLOGY CO LTD (CN)

C08L71/12; C08K3/22; C08L63/00

CN109553955A	2019-04-02
CN106205910A	2016-12-07
CN110113026A	2019-08-09
CN1876705A	2006-12-13
US20180153453A1	2018-06-07

BEYOND ATTORNEYS AT LAW (CN)

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