MAGNETIC DIELECTRIC RESIN COMPOSITION, AND PREPREG AND COPPER CLAD LAMINATE COMPRISING SAME

WIPO Patent Application WO/2022/088247

A1

A magnetic dielectric resin composition, and a prepreg and a copper clad laminate comprising same. The magnetic dielectric resin composition comprises a resin and a magnetic filler. The absolute value of the temperature drift coefficient of the magnetic filler under the conditions of −55°C to 150°C is 0-1000 ppm/°C. Preparation raw materials of the magnetic filler comprise a combination of iron oxide and a metal oxide. By means of mutual synergy of the resin and the specific magnetic filler, and on the premise of ensuring good dielectric properties, the magnetic dielectric resin composition has a high magnetic permeability, a low magnetic loss, and a proper cut-off frequency, and can also reduce a temperature drift coefficient and improve stability. The copper clad laminate comprising the magnetic dielectric resin composition has a high relative magnetic permeability, a low magnetic loss, a low temperature drift coefficient, and a superior thermal stability, and can fully satisfy application requirements for copper clad laminate in the preparation of high-performance and miniaturized electronic products.

YIN WEIFENG (CN)
LIU QIANFA (CN)
SHI JIANYING (CN)
ZHANG JIANGLING (CN)
LI SHA (CN)
CHAI SONGGANG (CN)
XU YONGJING (CN)
HUO CUI (CN)

PCT/CN2020/127788

May 05, 2022

November 10, 2020

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SHENGYI TECHNOLOGY CO LTD (CN)

C08L71/12; C08K3/22; C08L63/00

WO2018194100A1

2018-10-25

CN109553955A	2019-04-02
CN110494493A	2019-11-22
CN106928660A	2017-07-07
CN104910823A	2015-09-16

BEYOND ATTORNEYS AT LAW (CN)

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