Title:
MALEIMIDE RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/102782
Kind Code:
A1
Abstract:
The present invention relates to a maleimide resin composition which contains (A) one or more compounds that are selected from the group consisting of maleimide compounds having one or more N-substituted maleimide groups and derivatives of the maleimide compounds, and (B) a polymer that has a hydrocarbon chain or a polyether chain as the main chain, wherein the component (A) dissolves in an alcohol solvent, a ketone solvent, an aromatic hydrocarbon solvent, an ester solvent or a nitrogen atom-containing solvent at a concentration of 30% by mass or more at 25°C. The present invention also relates to a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package, each of which is obtained using the maleimide resin composition.
Inventors:
SATO NAOYOSHI (JP)
GOZU SHUJI (JP)
KAKITANI MINORU (JP)
TANIGAWA TAKAO (JP)
AKEBI RYUJI (JP)
HAYASHI CHIHIRO (JP)
GOZU SHUJI (JP)
KAKITANI MINORU (JP)
TANIGAWA TAKAO (JP)
AKEBI RYUJI (JP)
HAYASHI CHIHIRO (JP)
Application Number:
PCT/JP2021/041993
Publication Date:
May 19, 2022
Filing Date:
November 16, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08L79/00; B32B5/28; B32B15/088; B32B27/34; C08J5/24; C08L15/00; C08L71/00; H05K1/03
Domestic Patent References:
| WO2020017412A1 | 2020-01-23 | |||
| WO2020217676A1 | 2020-10-29 | |||
| WO2020262537A1 | 2020-12-30 |
Foreign References:
| JP2018012747A | 2018-01-25 | |||
| JP2008133454A | 2008-06-12 | |||
| JP2008095061A | 2008-04-24 | |||
| JPH06192478A | 1994-07-12 |
Other References:
See also references of EP 4245807A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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