Title:
MALEIMIDE RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/102781
Kind Code:
A1
Abstract:
The present invention relates to a maleimide resin composition containing: (A) one or more substance selected from the group consisting of maleimide compounds having one or more N-substituted maleimide groups and derivatives thereof; and (B) a polymer having a hydrocarbon chain or a polyether chain in the main chain thereof, wherein component (A) contains (A1) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of less than 600 and (A2) a maleimide compound having one or more N-substituted maleimide groups and a molecular weight of 600 or more. The present invention also relates to a prepreg, a laminated board, a resin film, a printed wiring board, and a semiconductor package which are obtained by using the maleimide resin composition.
Inventors:
SATO NAOYOSHI (JP)
GOZU SHUJI (JP)
KAKITANI MINORU (JP)
TANIGAWA TAKAO (JP)
AKEBI RYUJI (JP)
HAYASHI CHIHIRO (JP)
GOZU SHUJI (JP)
KAKITANI MINORU (JP)
TANIGAWA TAKAO (JP)
AKEBI RYUJI (JP)
HAYASHI CHIHIRO (JP)
Application Number:
PCT/JP2021/041984
Publication Date:
May 19, 2022
Filing Date:
November 16, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B5/28; B32B15/08; B32B27/32; C08F279/02; C08J5/24; C08L53/00; H05K1/03
Domestic Patent References:
| WO2014181456A1 | 2014-11-13 | |||
| WO2020217678A1 | 2020-10-29 |
Foreign References:
| JP2016204639A | 2016-12-08 | |||
| JP2016196549A | 2016-11-24 | |||
| JPS5655449A | 1981-05-16 | |||
| JPS62127310A | 1987-06-09 | |||
| JP2009035710A | 2009-02-19 |
Other References:
See also references of EP 4245518A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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