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Patent Searching and Data


Title:
MALEIMIDE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/234829
Kind Code:
A1
Abstract:
The present invention provides: a maleimide resin that exhibits excellent heat resistance and electrical properties and that has excellent curability; and a curable resin composition and a cured product thereof. This maleimide resin is obtained by reacting a styrene-maleic acid copolymer, a compound having two or more amino groups in the molecule, and maleic anhydride.

Inventors:
TOHJIMA TAKAYUKI (JP)
NAKANISHI MASATAKA (JP)
HASHIMOTO MASANORI (JP)
Application Number:
PCT/JP2022/019408
Publication Date:
November 10, 2022
Filing Date:
April 28, 2022
Export Citation:
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Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F8/32; C08F212/08; C08F220/08
Foreign References:
JP2017137492A2017-08-10
JPH08319315A1996-12-03
JP2012056989A2012-03-22
JP2005068429A2005-03-17
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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