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Patent Searching and Data


Title:
MANAGEMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/048095
Kind Code:
A1
Abstract:
The present invention provides a management system capable of suppressing the occurrence of abnormalities in a product film. The management system is configured to comprise: a cutting unit for cutting an original material film into product film and residue; an introducing unit into which the residue is introduced; an accommodating unit for accommodating the residue; a conveying pipe unit connecting the introducing unit and the accommodating unit together; a suction blower unit for sucking the residue from the introducing unit side to the accommodating unit side; a cutting blower unit for cutting the residue; a vibration measuring unit for measuring vibration data of the introducing unit; a data extracting unit for extracting first frequency band data in a range of 50 Hz to 300 Hz and second frequency band data in a range of 3000 Hz to 6000 Hz from the vibration data; a calculating unit for calculating a first feature quantity and a second feature quantity from the first frequency band data and the second frequency band data, respectively, and calculating a product of the first feature quantity and the second feature quantity; and a determining unit for determining that there is a pre-indication of an abnormality of the cutting blower unit if the product of the first feature quantity and the second feature quantity is equal to or greater than a first threshold.

Inventors:
NAGAISHI MAKOTO (JP)
HANADA KOJI (JP)
Application Number:
PCT/JP2023/026035
Publication Date:
March 07, 2024
Filing Date:
July 14, 2023
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
B26D7/18; B02C18/14; B26D1/02; B26D3/00
Domestic Patent References:
WO2010098044A12010-09-02
Foreign References:
JP2015213864A2015-12-03
JPH07285609A1995-10-31
JPH10114430A1998-05-06
JP2005238801A2005-09-08
JPH0469526A1992-03-04
JP2014148125A2014-08-21
Attorney, Agent or Firm:
FUJITA Takashi et al. (JP)
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