Title:
MANUFACTURING METHOD FOR ELECTRON MULTIPLIER SUBSTRATE, MANUFACTURING METHOD FOR ELECTRON MULTIPLIER, AND MANUFACTURING METHOD FOR RADIATION DETECTOR
Document Type and Number:
WIPO Patent Application WO/2012/073758
Kind Code:
A1
Abstract:
Among a side wall (101a) of a through-hole (101) and a substrate main surface, a base layer having a main surface exhibiting low adhesion with a conductive layer as the upper surface thereof is formed on the side wall (101a) of the through-hole (101). A conductive layer is formed on the substrate main surface and the side wall (101a) of the through hole (101) on which the base layer is formed, and the base layer formed on the side wall (101a) of the through hole (101) is selectively etched.
Inventors:
FUSHIE TAKASHI (JP)
KIKUCHI HAJIME (JP)
KIKUCHI HAJIME (JP)
Application Number:
PCT/JP2011/076904
Publication Date:
June 07, 2012
Filing Date:
November 22, 2011
Export Citation:
Assignee:
HOYA CORP (JP)
FUSHIE TAKASHI (JP)
KIKUCHI HAJIME (JP)
FUSHIE TAKASHI (JP)
KIKUCHI HAJIME (JP)
International Classes:
G01T1/18; G01T3/00; H01J47/06; H01J47/12
Domestic Patent References:
| WO2009127220A1 | 2009-10-22 |
Foreign References:
| JP2009301904A | 2009-12-24 | |||
| JP2007234485A | 2007-09-13 | |||
| JP2006302844A | 2006-11-02 |
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
Ani store Setsuo (JP)
Ani store Setsuo (JP)
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Claims: