Title:
MANUFACTURING METHOD OF RADIATION IMAGE CAPTURE DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/132396
Kind Code:
A1
Abstract:
This manufacturing method of a radiation image capture device involves: a step in which a flexible base material is provided on a support body to form a sensor board on which multiple pixels are provided that accumulate charge generated in response to light converted from radiation; a step in which a conversion layer for converting radiation into light is formed on a fixing plate; a step in which, on a first surface of the substrate where the pixels are provided, a conversion layer is provided in a state in which the fixing plate and the opposite-side surface face each other; a step in which one end of a flexible cable is fixed to the sensor board; a step in which the flexible cable is fixed to the fixing plate; and a step in which the sensor board where the conversion layer and the fixing plate are provided is peeled from the support body.
Inventors:
NAKATSUGAWA HARUYASU (JP)
USHIKURA SHINICHI (JP)
KATO MUNETAKA (JP)
USHIKURA SHINICHI (JP)
KATO MUNETAKA (JP)
Application Number:
PCT/JP2020/048289
Publication Date:
July 01, 2021
Filing Date:
December 23, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G01T1/20
Domestic Patent References:
| WO2019181570A1 | 2019-09-26 | |||
| WO2019181569A1 | 2019-09-26 | |||
| WO2019181639A1 | 2019-09-26 |
Foreign References:
| JP2012052965A | 2012-03-15 | |||
| US20190333961A1 | 2019-10-31 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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