Title:
MASK PLATE, AND ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/241244
Kind Code:
A1
Abstract:
Provided in the present disclosure are a mask plate, and an electronic device and a manufacturing method therefor. The mask plate is configured to mask a back plate. The back plate comprises a substrate, and an insulation layer and a bonding pad group, which are located on the substrate. The bonding pad group comprises at least two bonding pads; the insulation layer comprises an opening; and the bonding pads are arranged, at the opening, protruding out of the side of the insulation layer away from the substrate. The mask plate comprises a through hole, wherein the orthographic projection of the through hole on the substrate overlaps with the orthographic projection of each bonding pad on the substrate; and a blind hole, wherein the blind hole is arranged surrounding the through hole, the size of the blind hole in a thickness direction of the mask plate is greater than or equal to the size of the bonding pads protruding out of the insulation layer, and the orthographic projection of the blind hole on the substrate and the orthographic projection of the through hole on the substrate are spliced to cover the orthographic projection of each bonding pad on the substrate.
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Inventors:
DONG ENKAI (CN)
CHU YUTIAN (CN)
ZHAI MING (CN)
QI JIACHENG (CN)
WANG LE (CN)
ZHOU QIQI (CN)
CHU YUTIAN (CN)
ZHAI MING (CN)
QI JIACHENG (CN)
WANG LE (CN)
ZHOU QIQI (CN)
Application Number:
PCT/CN2023/091545
Publication Date:
December 21, 2023
Filing Date:
April 28, 2023
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
BOE MLED TECHNOLOGY CO LTD (CN)
BOE MLED TECHNOLOGY CO LTD (CN)
International Classes:
H05K3/34; B41N1/24; H05K3/12
Foreign References:
| CN217936140U | 2022-11-29 | |||
| US6316289B1 | 2001-11-13 | |||
| JP2008124282A | 2008-05-29 | |||
| US20020023554A1 | 2002-02-28 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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