Title:
MASKING TAPE FOR SHOT PEENING PROCESS
Document Type and Number:
WIPO Patent Application WO/2017/130678
Kind Code:
A1
Abstract:
Provided is a masking tape for a shot peening process, the masking tape comprising a base material having a first surface and a second surface, and an adhesive layer disposed over the first surface on the base material. The masking tape has a fracture strength of 55 N/15 mm or greater, and exhibits an impact absorption rate of 20% or greater in a ball-drop impact test. In addition, the masking tape is such that, when a 40°C holding power test is carried out by attaching thereto a load of 500 g, the displacement distance from the initial position after one hour is 2 mm or shorter.
Inventors:
HIDA TAKAFUMI (JP)
KITAYAMA KAZUHIRO (JP)
SASAKI SHU (JP)
KITAYAMA KAZUHIRO (JP)
SASAKI SHU (JP)
Application Number:
PCT/JP2017/000409
Publication Date:
August 03, 2017
Filing Date:
January 10, 2017
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B24C1/04; B24C1/10; B32B7/02; B32B27/00; B32B27/30; C09J7/20; C09J7/38; C09J121/00; C09J161/14
Foreign References:
JPH07133468A | 1995-05-23 | |||
JPH0873823A | 1996-03-19 | |||
JP2013049862A | 2013-03-14 | |||
JP2010234552A | 2010-10-21 | |||
JP2000303833A | 2000-10-31 | |||
JP2000227119A | 2000-08-15 | |||
JP2004255797A | 2004-09-16 | |||
JPS5720690B2 | 1982-04-30 | |||
JP2015196792A | 2015-11-09 |
Other References:
See also references of EP 3409738A4
Attorney, Agent or Firm:
OI Michiko (JP)
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