Title:
MATERIAL FOR FORMING RESIST-SENSITIZING FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/021347
Kind Code:
A1
Abstract:
Disclosed is a material for forming a resist-sensitizing film, which is capable of forming a resist-sensitizing film that can improve the sensitivity of an electron beam resist without deteriorating the resolution of the electron beam resist. Also disclosed is a method for manufacturing a semiconductor device using the material for forming a resist-sensitizing film.
The material for forming a resist-sensitizing film contains a metal salt, a resin and a solvent.
Inventors:
KON JUNICHI (JP)
Application Number:
PCT/JP2009/064532
Publication Date:
February 25, 2010
Filing Date:
August 19, 2009
Export Citation:
Assignee:
FUJITSU LTD (JP)
KON JUNICHI (JP)
KON JUNICHI (JP)
International Classes:
G03F7/38; G03F7/11
Foreign References:
| JP2005512309A | 2005-04-28 | |||
| JP2008019423A | 2008-01-31 | |||
| JPH09281705A | 1997-10-31 | |||
| JP2004119414A | 2004-04-15 | |||
| JP2007147854A | 2007-06-14 | |||
| JP2002067526A | 2002-03-08 | |||
| JPS6299199A | 1987-05-08 | |||
| JPH0815868A | 1996-01-19 |
Attorney, Agent or Firm:
HIROTA, KOICHI (JP)
Koichi Hirota (JP)
Koichi Hirota (JP)
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