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Title:
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/021346
Kind Code:
A1
Abstract:
A translucent cover layer which improves light extraction efficiency is more easily formed. A semiconductor light emitting device (1) has a sub-mount (2), a semiconductor light emitting element (3) mounted on the sub-mount (2), and a translucent cover layer (4) completely covering the semiconductor light emitting element (3).  The translucent layer (4) is formed such that a section in contact with the sub-mount (2) has different contact angles (θ) to the sub-mount (2) on the sub-mount (2) at discretionary contact points (Pe1, Pe2) on an outer boundary (Lb).

Inventors:
HORIE HIDEYOSHI (JP)
EBIHARA WATARU (JP)
Application Number:
PCT/JP2009/064529
Publication Date:
February 25, 2010
Filing Date:
August 19, 2009
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
HORIE HIDEYOSHI (JP)
EBIHARA WATARU (JP)
International Classes:
H01L33/00; H01S5/022
Domestic Patent References:
WO2008023746A12008-02-28
WO2007018560A12007-02-15
WO2008018336A12008-02-14
Foreign References:
JPH0529664A1993-02-05
JP2003318449A2003-11-07
JP2000269552A2000-09-29
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JP2001196644A2001-07-19
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JP2008131007A2008-06-05
JP2007103978A2007-04-19
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JPH07231120A1995-08-29
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Attorney, Agent or Firm:
OGURI Shohei et al. (JP)
Shohei Oguri (JP)
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