Title:
MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD FOR PRODUCING RESIST UNDERLAYER FILM, AND LAMINATED BODY
Document Type and Number:
WIPO Patent Application WO/2018/221575
Kind Code:
A1
Abstract:
The material for forming an underlayer film according to the present invention is a material for forming a resist underlayer film to be used in a multilayer resist process, the material containing a cyclic olefin polymer including repeating structure units [A] represented by general formula (1) and repeating structure units [B] represented by general formula (2). The molar ratio [A]/[B] of the structure units [A] to the structure units [B] in the cyclic olefin polymer is 5/95 to 95/5.
Inventors:
INOUE KOJI (JP)
ODA TAKASHI (JP)
KAWASHIMA KEISUKE (JP)
ODA TAKASHI (JP)
KAWASHIMA KEISUKE (JP)
Application Number:
PCT/JP2018/020744
Publication Date:
December 06, 2018
Filing Date:
May 30, 2018
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
G03F7/11; B32B27/00; C08G61/08
Foreign References:
| JP2008026600A | 2008-02-07 | |||
| JP2006098807A | 2006-04-13 | |||
| JP2006098984A | 2006-04-13 | |||
| JP2006106214A | 2006-04-20 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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