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Title:
MATERIAL FOR METAL PATTERNING, HETEROCYCLIC COMPOUND, THIN FILM FOR METAL PATTERNING, ORGANIC ELECTROLUMINESCENT DEVICE, ELECTRONIC DEVICE, AND METHOD FOR FORMING METAL PATTERN
Document Type and Number:
WIPO Patent Application WO/2023/153482
Kind Code:
A1
Abstract:
Provided are: a material for metal patterning, that can strongly suppress the formation of a metal thin film at a film surface; a heterocyclic compound; a thin film for metal patterning that uses these; an organic electroluminescent device; a method for forming a metal pattern; and an electronic device. The material for metal patterning is represented by formula (A1) or (B1), wherein in the formulas each A independently represents N or CR with at least one being N and at least one being CR; and B represents N, NR, S, O, or CR with at least one being N, S, or O and at least one being CR.

Inventors:
KAWASHIMA HIROYUKI (JP)
KOIKE KENJI (JP)
MATSUMOTO NAOKI (JP)
NOMURA SHINTARO (JP)
OTA ERIKO (JP)
HATTORI KAZUKI (JP)
Application Number:
PCT/JP2023/004430
Publication Date:
August 17, 2023
Filing Date:
February 09, 2023
Export Citation:
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Assignee:
TOSOH CORP (JP)
International Classes:
C07D251/34; H10K85/60; C07D401/04; H01L21/3065; H10K50/805; H10K50/81; H10K71/60; H10K102/20
Domestic Patent References:
WO2020225778A12020-11-12
WO2021172371A12021-09-02
WO2022034907A12022-02-17
WO2020225778A12020-11-12
WO2021172371A12021-09-02
WO2022034907A12022-02-17
Foreign References:
KR102324529B12021-11-12
KR102324529B12021-11-12
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