Title:
MEASURING DEVICE AND METHOD FOR MEASURING SURFACE OF SAMPLE
Document Type and Number:
WIPO Patent Application WO/2020/075385
Kind Code:
A1
Abstract:
A measuring device, for irradiating a sample having an uneven portion with a charged particle beam and measuring the shape of the sample, irradiates the sample with the charged particle beam at any angle, generates a profile indicating a relationship between an irradiation position and an intensity of emitted electrons, and performs an analysis process for analyzing the shape of the sample by using two profiles.
Inventors:
DOBASHI TAKASHI (JP)
SHINTANI ATSUKO (JP)
SAKAKIBARA MAKOTO (JP)
KIM HYEJIN (JP)
TAMAKI HIROKAZU (JP)
HIROSE KOTOKO (JP)
SHINTANI ATSUKO (JP)
SAKAKIBARA MAKOTO (JP)
KIM HYEJIN (JP)
TAMAKI HIROKAZU (JP)
HIROSE KOTOKO (JP)
Application Number:
PCT/JP2019/031904
Publication Date:
April 16, 2020
Filing Date:
August 14, 2019
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
H01J37/22; G01B15/04; H01J37/147; H01J37/20
Domestic Patent References:
WO2018052083A1 | 2018-03-22 | |||
WO2017179138A1 | 2017-10-19 | |||
WO2015083548A1 | 2015-06-11 |
Foreign References:
JP2019087518A | 2019-06-06 | |||
JP2017062174A | 2017-03-30 | |||
JP2017016791A | 2017-01-19 | |||
US20170102343A1 | 2017-04-13 |
Attorney, Agent or Firm:
TOU-OU PATENT FIRM (JP)
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