MEMS DEVICE AND PRODUCTION METHOD FOR SAME

WIPO Patent Application WO/2011/129352

A1

Disclosed is a production method for MEMS devices, whereby it is easy to manufacture a structure in which the surface of a substrate and the bottom surface of a vibration member face one another with a sufficiently narrow gap therebetween. The MEMS device production method is a method for producing a MEMS device that comprises a vibrating section (2), which is a floating structure affixed to a substrate, and a raised facing section (5), which is separate from and faces part of the vibrating section (2) region. Said method includes: a step for preparing an SOI substrate; a step for patterning a first silicone layer, forming an outer frame section and the raised facing section (5), and forming through-holes (18) in the raised and facing section (5); a step for creating a state of separation between the raised facing section (5) and a second silicone layer by etching away part of an intermediate insulating layer; a step for collectively adhering substrates so as to cover the outer frame and the raised facing section; and a step for forming a vibrating section (2) by patterning the second silicone layer and then further isolating the raised facing section.

SUZUKI KENICHIRO (JP)
TAMANO AKIMASA (JP)
OKADA MITSUHIRO (JP)
KISO MASAYA (JP)

PCT/JP2011/059138

October 20, 2011

April 13, 2011

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SANYO ELECTRIC CO (JP)
RITUMEIKAN TRUST (JP)
SUZUKI KENICHIRO (JP)
TAMANO AKIMASA (JP)
OKADA MITSUHIRO (JP)
KISO MASAYA (JP)

H03H3/007; B81B3/00; B81C1/00; H03H9/24

WO2009110442A1

2009-09-11

JP2008072209A	2008-03-27
JP2006231489A	2006-09-07

Hiroshi Sumiya (JP)
KADOYA HIROSHI (JP)

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