Title:
MEMS PRESSURE SENSOR PACKAGING STRUCTURE AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/258117
Kind Code:
A1
Abstract:
An MEMS pressure sensor packaging structure and a packaging method. The packaging structure comprises: a flexible circuit board (5); an MEMS pressure sensor (4) fixed on a surface of the flexible circuit board (5), electrically connected to the flexible circuit board (5), and comprising a pressure-sensitive structure; a rigid shell (2) configured to form an open cavity in which the MEMS pressure sensor (4) is received; and a packaging filling agent (1) configured to fill the open cavity, cover a pressure sensitive structure and exposed gold wires (3) of the MEMS pressure sensor (4), and form a protruding part (8) outside the open cavity, wherein the packaging filling agent (1) can conduct pulse pressure to the pressure sensitive structure of the MEMS pressure sensor (4), so that the MEMS pressure sensor (4) can collect pulse pressure signals. By fixing the rigid shell (2) around the MEMS pressure sensor (4), the electrical connection between the MEMS pressure sensor (4) and the substrate is protected, and the packaging filling agent (1) is used as a pressure conducting medium, so that the stability and the sensitivity of the sensor are improved.
Inventors:
CHEN CHUANGLU (CN)
LI ZHIQIANG (CN)
ZHANG SHAOLONG (CN)
ZHANG YITAO (CN)
HOU ZHE (CN)
ZHANG HAIYING (CN)
LI ZHIQIANG (CN)
ZHANG SHAOLONG (CN)
ZHANG YITAO (CN)
HOU ZHE (CN)
ZHANG HAIYING (CN)
Application Number:
PCT/CN2019/093154
Publication Date:
December 30, 2020
Filing Date:
June 27, 2019
Export Citation:
Assignee:
INST OF MICROELECTRONICS CAS (CN)
International Classes:
B81B7/00; A61B5/02; B81B7/02; B81C1/00
Foreign References:
| CN101427923A | 2009-05-13 | |||
| CN101532889A | 2009-09-16 | |||
| CN108784664A | 2018-11-13 | |||
| CN205066978U | 2016-03-02 | |||
| US20170010166A1 | 2017-01-12 |
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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