MEMS SENSOR

WIPO Patent Application WO/2020/073357

A1

An MEMS sensor comprises: a substrate (2) and a vibration diaphragm (1) supported above the substrate (2) by means of a spacing portion (4), the substrate (2), the spacing portion (4), and the vibration diaphragm (1) enclosing to form a vacuum cavity (3), wherein a static deflection distance of the vibration diaphragm (1) under atmospheric pressure is less than the distance between the vibration diaphragm (1) and the substrate (2); a testing structure outputting an electrical signal representing deformation of the vibration diaphragm (1); and a drive device configured to provide the vibration diaphragm (1) with a force resisting external pressure and directed away from the vacuum cavity (3). The sensor is designed to have the vacuum cavity (3), and the viscosity of residual gas in the vacuum cavity (3) is significantly lower than the viscosity of air under standard pressure, thereby eliminating acoustic resistance during vibration of the vibration diaphragm (1), so as to improve the signal-to-noise ratio (SNR) of a microphone, and accordingly enhancing acoustic performance of the microphone. Under the action of the drive device, the vibration diaphragm (1) maintains higher mechanical sensitivity while effectively resisting external pressure, thereby enabling the vibration diaphragm (1) to provide superior representation of a sound pressure.

ZOU QUANBO (CN)
LENG QUNWEN (CN)

PCT/CN2018/111313

April 16, 2020

October 23, 2018

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GOERTEK INC (CN)
QINGDAO RESEARCH INSTITUTE OF BEIHANG UNIV (CN)

H04R19/04

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CN105792084A	2016-07-20
CN104333838A	2015-02-04
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