Title:
METAL-CONTAINING FILM FORMATION COMPOSITION, METAL-CONTAINING FILM, METAL-CONTAINING FILM FORMATION METHOD, AND PRODUCTION METHOD OF METAL-CONTAINING FILM FORMATION COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/118698
Kind Code:
A1
Abstract:
Provided are: a metal-containing film formation composition from which a metal-containing film having excellent film continuity, electric conductivity, and embedding characteristics can be formed; the metal-containing film; a metal-containing film formation method; and a production method of the metal-containing film formation composition. This metal-containing film formation composition contains a metal compound, a nitrogen-containing organic compound, and a solvent, wherein the nitrogen-containing organic compound is represented by formula (1) below. (In formula (1), R1 and R3 independently represent a substituted or unsubstituted monovalent aliphatic hydrocarbon group having a carbon number of 1 to 10. R2 and R4 independently represent a hydrogen atom or a substituted or unsubstituted monovalent aliphatic hydrocarbon group having a carbon number of 1 to 10. At least one of R1, R2, R3, and R4 includes a hydroxy group.)
Inventors:
HIRASAWA KENGO (JP)
OZAKI YUKI (JP)
OOTSUBO YUUSUKE (JP)
SAKAI KAZUNORI (JP)
OZAKI YUKI (JP)
OOTSUBO YUUSUKE (JP)
SAKAI KAZUNORI (JP)
Application Number:
PCT/JP2021/042885
Publication Date:
June 09, 2022
Filing Date:
November 24, 2021
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C23C18/02; C23C18/34
Domestic Patent References:
| WO2005117029A1 | 2005-12-08 | |||
| WO2020138121A1 | 2020-07-02 |
Foreign References:
| JP2008248335A | 2008-10-16 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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