METAL COPPER FINE PARTICLE-CONTAINING RESIN COMPOSITION AND METHOD FOR PRODUCING SAME

Title:

METAL COPPER FINE PARTICLE-CONTAINING RESIN COMPOSITION AND METHOD FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2020/204119

Kind Code:

A1

Abstract:

The present invention relates to a metal copper fine particle-containing resin composition, in which metal copper fine particles capable of efficiently exhibiting anti-virus properties are uniformly dispersed, and a method for producing the same, the composition being characterized by containing, in a resin, metal copper fine particles coated with fatty acids and/or ester compounds.

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Inventors:

KOSAKA YASUHIRO (JP)
OHASHI KAZUAKI (JP)
KOGANEI AKIKO (JP)
IKUTAME DAISUKE (JP)
HAMANO RYOSUKE (JP)
ISHIKO AKIRA (JP)

Application Number:

PCT/JP2020/015135

Publication Date:

October 08, 2020

Filing Date:

April 02, 2020

Export Citation:

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Assignee:

TOYO SEIKAN GROUP HOLDINGS LTD (JP)
TOMATEC CO LTD (JP)

International Classes:

C08J3/20; A01N25/10; A01N59/20; A01P3/00; C08K3/08; C08K9/04; C08L101/00

Foreign References:

JPH07316009A	1995-12-05
JP2017178942A	2017-10-05
JP2018100234A	2018-06-28
JP2018100255A	2018-06-28
JP2019119837A	2019-07-22
US20060047022A1	2006-03-02
JP2018095607A	2018-06-21
JP2019065363A	2019-04-25

Attorney, Agent or Firm:

ONO, Hisazumi et al. (JP)

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