Title:
METAL PARTICLE AGGREGATE, CONDUCTIVE FILM, CONNECTION STRUCTURE, AND PRODUCTION METHODS FOR SAME
Document Type and Number:
WIPO Patent Application WO/2023/199633
Kind Code:
A1
Abstract:
Provided are: a fine metal particle aggregate having a uniform particle-size distribution and exhibiting excellent transfer characteristics; a conductive film; a connection structure; and production methods for the same. A metal particle aggregate 1 is an aggregate of metal particles 2 and has pores 3 in the surface thereof. When the aggregate is transferred onto a conductive film 5 and is observed on the surface of the conductive film 5, the pores 3 account for 5% or more of the area of the aggregate in the plan view.
Inventors:
WATANABE KAZUMU (JP)
NODA DAIKI (JP)
SHIRAIWA TOSHIKI (JP)
TSUKAO REIJI (JP)
HAYASHI NAOKI (JP)
NAMIKI HIDETSUGU (JP)
NODA DAIKI (JP)
SHIRAIWA TOSHIKI (JP)
TSUKAO REIJI (JP)
HAYASHI NAOKI (JP)
NAMIKI HIDETSUGU (JP)
Application Number:
PCT/JP2023/007553
Publication Date:
October 19, 2023
Filing Date:
March 01, 2023
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B22F1/00; B22F1/148; B22F1/054; B22F1/102; B22F7/08; H01B5/00; H01B5/14; H01B5/16; H01R11/01; H05K3/32
Foreign References:
| JP2020009718A | 2020-01-16 | |||
| JP2019134087A | 2019-08-08 | |||
| US20150322298A1 | 2015-11-12 | |||
| JP2019067693A | 2019-04-25 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro et al. (JP)
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