Title:
METAL SHEET BONDING AGENT, METHOD FOR MANUFACTURING REINFORCEMENT MEMBER FOR PRINTED WIRING BOARD, AND WIRING BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2023/188206
Kind Code:
A1
Abstract:
Provided are: a metal sheet bonding agent that has excellent adhesive strength and solder reflow tolerance and that reduces adhesive residues generated during detachment from metal sheets and the like; a reinforcement member that is for a printed wiring board and that is provided with the bonding agent; and a wiring board. A metal sheet bonding agent (10) according to the present disclosure is sheet like, and contains an electrically conductive component (A) and a binder (B). The binder (B) contains a resin. The content proportion of the binder (B) is 10-60 mass% in the mass of the metal sheet bonding agent (10). The spread area ratio Sdr of the metal sheet bonding agent (10) on one surface is 0.01-5.0.
Inventors:
KISHI DAISUKE (JP)
MATSUO TAMAKI (JP)
NISHINOHARA SATOSHI (JP)
MATSUO TAMAKI (JP)
NISHINOHARA SATOSHI (JP)
Application Number:
PCT/JP2022/016346
Publication Date:
October 05, 2023
Filing Date:
March 30, 2022
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCHEM CO LTD (JP)
TOYOCHEM CO LTD (JP)
International Classes:
C09J9/02; C09J7/00; H05K1/02; H05K3/32; H05K9/00
Foreign References:
| JP2017025280A | 2017-02-02 | |||
| JP2010108971A | 2010-05-13 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
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