METHOD AND APPARATUS FOR PRODUCING BENEFICIAL STRESSES AROUND APERTURES BY THE USE OF FOCUSED STRESS WAVES

Title:

METHOD AND APPARATUS FOR PRODUCING BENEFICIAL STRESSES AROUND APERTURES BY THE USE OF FOCUSED STRESS WAVES

Document Type and Number:

WIPO Patent Application WO1999047303

Kind Code:

A9

Abstract:

Tooling and a method of employing tooling (90, 130) to produce beneficial stress waves in a substrate (132) to provide high fatigue life structures. Stress waves (159, 152) are provided to work a substrate, causing dimples (170) in the workpiece, along a uniform pressure profile in the workpiece. By use of the method, uniform beneficial residual stress is provided at surface and midplane apertures in a workpiece, so as to improve overall fatigue life. An improved tool shape (92) is described, having a smooth curve, rather than a flat punch. Also, the use of a consumable wafer (W) provides additional uniform stress profile benefits.

Inventors:

EASTERBROOK ERIC T (US)

Application Number:

PCT/US1999/005700

Publication Date:

November 18, 1999

Filing Date:

March 16, 1999

Export Citation:

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Assignee:

EASTERBROOK ERIC T (US)

International Classes:

B21D22/04; B21D28/24; B21J5/00; B21J15/00; B21J15/38; B23P9/02; B23P9/04; B24B39/06; C21D7/02; C21D7/04; (IPC1-7): B23P9/02; C21D7/04; B21J5/00; B24B39/06; B21D28/24

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