Title:
METHOD FOR BLACKENING WAFER, BLACKENED WAFER, AND SURFACE ACOUSTIC WAVE FILTER
Document Type and Number:
WIPO Patent Application WO/2022/061884
Kind Code:
A1
Abstract:
The present application relates to the relevant technical field of semiconductors, and discloses a method for blackening a wafer, a blackened wafer, and a surface acoustic wave filter. The method for blackening a wafer comprises: performing reduction treatment on a wafer; and using ultraviolet light to irradiate the wafer for a predetermined time period. A blackening uniformity DE value of the wafer is between 0.3-0.6, and a chromaticity L value is between 48-54. In the present application, using ultraviolet light to assist in the blackening process of a wafer can effectively improve the blackening uniformity DE value and the chromaticity L value of the wafer, thereby improving the transmittance of the wafer and increasing the yield of wafer blackening. The order of performing reduction treatment on the wafer and using ultraviolet light to irradiate the wafer for a predetermined time can be interchanged. Both approaches can increase the yield of wafer blackening.
More Like This:
Inventors:
LIU YILIN (CN)
LIN ZHONGHE (CN)
LIN YENFU (CN)
HUANG SHIHWEI (CN)
FANG MINGHUI (CN)
YANG SHENGYU (CN)
LIN ZHONGHE (CN)
LIN YENFU (CN)
HUANG SHIHWEI (CN)
FANG MINGHUI (CN)
YANG SHENGYU (CN)
Application Number:
PCT/CN2020/118397
Publication Date:
March 31, 2022
Filing Date:
September 28, 2020
Export Citation:
Assignee:
FUJIAN JINGAN OPTOELECTRONICS CO LTD (CN)
International Classes:
C30B29/30; C30B33/02
Foreign References:
| CN110129891A | 2019-08-16 | |||
| CN110670134A | 2020-01-10 | |||
| CN110760934A | 2020-02-07 | |||
| CN110835781A | 2020-02-25 | |||
| CN105204189A | 2015-12-30 | |||
| US20200076399A1 | 2020-03-05 |
Download PDF: