Title:
METHOD FOR CUTTING BRITTLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/026191
Kind Code:
A1
Abstract:
A blade edge is moved on a first surface (SF1) of a brittle substrate (11) while the blade edge is pressed against the first surface (SF1), and a trench line (TL) having a first portion (LR) and a second portion (HR) is thereby formed so as to be in a crackless state. The load applied to the blade edge in order to form the second portion (HR) is greater than the load applied to the blade edge in order to form the first portion (LR). A crack is caused to occur along the second portion (HR). A stress applying member (85) is brought into contact with a fourth portion (SP4) facing the second portion (HR) of the trench line (TL) in the second surface (SF2), while being separated from a third portion (SP3) facing the first portion (LR) of the trench line (TL) in the second surface (SF2). The stress applying member (85) is subsequently brought into contact with the third portion (SP3).
Inventors:
IWATSUBO YUMA (JP)
SOYAMA HIROSHI (JP)
SOYAMA HIROSHI (JP)
Application Number:
PCT/JP2016/069424
Publication Date:
February 16, 2017
Filing Date:
June 30, 2016
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
C03B33/023; B28D5/00
Domestic Patent References:
| WO2008136239A1 | 2008-11-13 | |||
| WO2005113212A1 | 2005-12-01 | |||
| WO2015151755A1 | 2015-10-08 |
Foreign References:
| JP2002316829A | 2002-10-31 | |||
| JPH09278473A | 1997-10-28 | |||
| JP2008307747A | 2008-12-25 | |||
| JP2016098152A | 2016-05-30 | |||
| JP2016098153A | 2016-05-30 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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