Title:
METHOD AND DEVICE FOR REMOVING CONDUCTIVE METAL OXIDE THIN FILM
Document Type and Number:
WIPO Patent Application WO/2007/015454
Kind Code:
A1
Abstract:
[PROBNLEMS] A method and a device for removing a conductive metal oxide thin film
without leaving a scar nor stress deformation. [MEANS OF SOLVING PROBLEMS] The
device comprises a first electrode (18) disposed so as to immerse one end thereof
into electrolyte (17), a second electrode (13) disposed so as to immerse one end
thereof into electrolyte (17) to allow the one end to face a conductive metal oxide
thin film (11) so that the conductive metal oxide thin film (11) of a base material
(12) immersed in the electrolyte (17) in a treating bath (16) acts as a cathodes,
and a power supply (14) for applying a dc voltage so that the second electrode (13)
acts as an anode and the first electrode (18) as a cathode. A dc voltage is applied
to the both electrodes (13, 18) to remove the conductive metal oxide thin film
(11) by a reduction reaction. [EFFECTS] A conductive metal oxide thin film can
be efficiently removed without causing a scan nor stress deformation, and hence
an expensive functional glass substrate or the like can be recycled.
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Inventors:
DAIKU HIROYUKI (JP)
INOUE TETSUYA (JP)
INOUE TETSUYA (JP)
Application Number:
PCT/JP2006/315135
Publication Date:
February 08, 2007
Filing Date:
July 31, 2006
Export Citation:
Assignee:
HITACHI SHIPBUILDING ENG CO (JP)
HITZ HI TECHNOLOGY CORP (JP)
DAIKU HIROYUKI (JP)
INOUE TETSUYA (JP)
HITZ HI TECHNOLOGY CORP (JP)
DAIKU HIROYUKI (JP)
INOUE TETSUYA (JP)
International Classes:
C03C23/00; C25F3/00; C25F7/00
Foreign References:
| JPH06321581A | 1994-11-22 | |||
| JPH0986968A | 1997-03-31 | |||
| JP2004531641A | 2004-10-14 |
Attorney, Agent or Firm:
MIZOGAMI, Mitsuyoshi et al. (1-10-4 Utsubo-Hommachi, Nishi-k, Osaka-shi Osaka 04, JP)
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