METHOD FOR DISMANTLING BONDED MEMBER, BONDED MEMBER, AND EASILY DISMANTLED SILICONE-BASED LIQUID ADHESIVE

WIPO Patent Application WO/2023/054052

A1

With regard to a bonded member in which a plurality of members are bonded together by a cured product obtained by curing a curable silicone-based liquid adhesive containing a hydroxide compound with a decomposition temperature of 180ºC-600ºC and a specific amount of particles which generate heat by means of microwaves, a dismantling method for the bonded member including a step in which the plurality of members are separated from each other by irradiating the cured product with microwaves and the bonded member is dismantled makes it possible to easily recycle the members because even though the cured product of the curable silicone-based liquid adhesive exhibits adhesiveness and/or sealing properties from room temperature to a high temperature of approximately 150ºC, the adhesiveness and/or sealing properties of the cured product of the curable silicone-based liquid adhesive are reduced by irradiating with microwaves, the plurality of members are easily separated from each other in a short time with little energy consumption, and it is thus possible to dismantle the bonded member.

KAMEDA NORIO (JP)

PCT/JP2022/034941

April 06, 2023

September 20, 2022

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SHINETSU CHEMICAL CO (JP)

C09J183/04; C09J11/04; C09J11/06; C09J183/07

WO2005071035A1

2005-08-04

JP2019147874A	2019-09-05
JP2000204332A	2000-07-25
JP2008056843A	2008-03-13
JP2004123943A	2004-04-22
JP2013518950A	2013-05-23
JP2020128463A	2020-08-27

PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)

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