Title:
METHOD FOR DRESSING POLISHING PAD, METHOD FOR POLISHING SILICON WAFER, METHOD FOR PRODUCING SILICON WAFER, AND DEVICE FOR POLISHING SILICON WAFER
Document Type and Number:
WIPO Patent Application WO/2024/018735
Kind Code:
A1
Abstract:
A method for dressing a polishing pad is proposed by which the polishing pad can be more evenly dressed even on a rotating platen having a curved surface. The method for dressing a polishing pad 100 comprises pressing the grindstone 12 of a pad dresser 1 having a grindstone 12 attached thereto against the polishing pad 100 adhered to a polishing platen and sliding the grindstone 12 thereon, thereby dressing the polishing pad 100. The dressing method is characterized in that the pad dresser 1 has been configured so that the dressing surface 12b of the grindstone 12 which slides on the polishing pad 100 is changeable in the radius of curvature R1 along the radial-direction of the polishing platen.
Inventors:
KURAMOTO RYO (JP)
MIYAZAKI YUJI (JP)
GOTO TAIKI (JP)
MIYAZAKI YUJI (JP)
GOTO TAIKI (JP)
Application Number:
PCT/JP2023/018002
Publication Date:
January 25, 2024
Filing Date:
May 12, 2023
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B53/017; B24B37/07; B24B37/12; B24B53/12; H01L21/304
Foreign References:
| JP2020168677A | 2020-10-15 | |||
| JP2001219363A | 2001-08-14 | |||
| US20040166785A1 | 2004-08-26 | |||
| JP2009016484A | 2009-01-22 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
Download PDF:
Previous Patent: MOVING BODY OPERATION MANAGEMENT DEVICE
Next Patent: ROBOT CONTROL METHOD, AND ROBOT CONTROL DEVICE
Next Patent: ROBOT CONTROL METHOD, AND ROBOT CONTROL DEVICE