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Title:
METHOD FOR DRYING SEMICONDUCTOR PACKAGE SUBSTRATE BY USING HOT AIR OR PLASMA AND DRYING DEVICE THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/158034
Kind Code:
A1
Abstract:
The present invention relates to a method and a cleaning device for cleaning an upper side and a lower side of a substrate by treating same with plasma and, more particularly, to subjecting the upper side and the lower side of the substrate to nozzle cleaning and ultrasonic cleaning treatment, followed by plasma treatment, among steps of cutting, cleaning, drying, transferring, and inspecting the substrate.

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Inventors:
LEE WON YOUNG (KR)
KIM YOUNG HO (KR)
HWANG IN JAE (KR)
LEE JONG WOOK (KR)
Application Number:
PCT/KR2022/011215
Publication Date:
August 24, 2023
Filing Date:
July 29, 2022
Export Citation:
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Assignee:
NEONTECH CO LTD (KR)
International Classes:
H05K3/26; B08B5/02; B08B7/00; B08B7/02; F26B5/04; F26B21/00; H01L21/02; H01L21/78
Foreign References:
KR102142536B12020-08-07
KR20080071638A2008-08-05
KR101498392B12015-03-03
KR20150054281A2015-05-20
US20180001355A12018-01-04
Attorney, Agent or Firm:
KANGIN PATENT LAW FIRM (KR)
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