Title:
METHOD FOR FIXING PIN OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/236165
Kind Code:
A1
Abstract:
The present application relates to the technical field of Printed Circuit Board Assembly (PCBA), and discloses a method for fixing a pin of an electronic component, for use in improving the soldering effect of the electronic component during soldering. The method provided by the present application comprises: bending a pin of an electronic component; performing stress relief forming on the bent pin; placing the electronic component subjected to stress relief forming in a height supporting jig, and limiting a distance between the electronic component and a circuit board by means of the height supporting jig; mounting the height supporting jig, for placing the electronic component, at a corresponding position on the circuit board; and soldering the electronic component onto the circuit board.
Inventors:
WEI YE (CN)
WANG DAQING (CN)
WANG DAQING (CN)
Application Number:
PCT/CN2022/097990
Publication Date:
December 14, 2023
Filing Date:
June 10, 2022
Export Citation:
Assignee:
FRANKLINWH TECH CO LTD (CN)
International Classes:
H01L23/48; B21F1/00; B21F11/00; H05K3/34
Foreign References:
| CN105185759A | 2015-12-23 | |||
| CN213818412U | 2021-07-27 | |||
| JPH0878601A | 1996-03-22 |
Attorney, Agent or Firm:
SHENZHEN ZHONGDINGHUICHENG INTELLECTUAL PROPERTY AGENCY (CN)
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