METHOD FOR FORMING CUT LINE AND DEVICE FOR FORMING CUT LINE

Title:

METHOD FOR FORMING CUT LINE AND DEVICE FOR FORMING CUT LINE

Document Type and Number:

WIPO Patent Application WO/2016/088600

Kind Code:

A1

Abstract:

Provided are a device and a method for forming a cut line which are able to start cutting by constantly bringing the same position of a round cutter into contact with a side end part of an optical film laminate when forming each of a plurality of cut lines. This method includes: a step for rotating the round cutter; a step for bringing a predetermined position on the external periphery of the round cutter into contact with a side end part of an optical film laminate and starting the cutting of the optical film laminate; a step for forming cut lines on the optical film laminate while moving the round cutter in the width direction of the optical film laminate; and a step for conveying the optical film laminate by a distance previously set as the distance between one cut line and the next cut line.

More Like This:

JPH0698588	PROBLEM TO BE SOLVED: To cut a strip-shaped material
JP2001252891	FILM CUTTING DEVICE AND METHOD
JP2006224264	APPARATUS FOR CUTTING-OFF RESIN FILM ROLL WOUND ON CORE MEMBER

Inventors:

MISHIMA JUN (JP)
MAEDA MINORU (JP)
YURA TOMOKAZU (JP)
KOSHIO SATORU (JP)

Application Number:

PCT/JP2015/082873

Publication Date:

June 09, 2016

Filing Date:

November 24, 2015

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NITTO DENKO CORP (JP)

International Classes:

B26D1/18; B26D3/00

Foreign References:

JP2013240841A	2013-12-05
JP2011065174A	2011-03-31
JP2011183514A	2011-09-22

Attorney, Agent or Firm:

PSD (JP)
Patent business corporation P. S. Di (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: ROLLER BEARING

Next Patent: ROTATION TRANSMISSION DEVICE