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Patent Searching and Data


Title:
METHOD FOR FORMING DENSE SILICIC FILM
Document Type and Number:
WIPO Patent Application WO/2014/057980
Kind Code:
A1
Abstract:
[Problem] To provide a dense silicic film and a method for forming the film. [Solution] A method for forming a dense silicic film which comprises applying, on a substrate, a composition for coating film formation which contains a polymer having silazane bonds, thereby forming a film, irradiating the film with light having a maximum peak wavelength of 160-179 nm, and successively irradiating the film with light having a maximum wavelength longer by 10-70 nm than the maximum peak wavelength of the light with which the film has been irradiated; and a dense silicic film formed by the method.

Inventors:
OZAKI YUKI (JP)
SAKURAI TAKAAKI (JP)
KOBAYASHI MASAKAZU (JP)
Application Number:
PCT/JP2013/077487
Publication Date:
April 17, 2014
Filing Date:
October 09, 2013
Export Citation:
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Assignee:
AZ ELECTRONIC MATERIALS MFG JAPAN KK (JP)
International Classes:
B05D7/24; B05D3/06; B32B9/00; C01B21/068; C08J7/00; C08J7/048
Domestic Patent References:
WO2012026482A12012-03-01
WO2011086839A12011-07-21
Foreign References:
JP2009503157A2009-01-29
JP2004155834A2004-06-03
JPH10279362A1998-10-20
JP2012056101A2012-03-22
JP2013052561A2013-03-21
JP2011146226A2011-07-28
JP2009503157A2009-01-29
JP2011143327A2011-07-28
Other References:
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, vol. 23, no. 2, 2010, pages 225 - 230
See also references of EP 2907587A4
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
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