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Title:
METHOD FOR FORMING DUAL-DECK CHANNEL HOLE STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/232784
Kind Code:
A1
Abstract:
A method for forming a channel hole structure of a 3D memory device is disclosed. The method includes: forming a first alternating dielectric stack and a first insulating layer on a substrate; forming a first channel structure in a first channel hole penetrating the first insulating layer and the first alternating dielectric stack; forming a sacrificial inter-deck plug in the first insulating layer; forming a second alternating dielectric stack on the sacrificial inter-deck plug; forming a second channel hole penetrating the second alternating dielectric stack and expose a portion of the sacrificial inter-deck plug; removing the sacrificial inter-deck plug to form a cavity; and forming an inter-deck channel plug in the cavity and a second channel structure in the second channel hole, the inter-deck channel plug contacts the first channel structure and the second channel structure.

Inventors:
TAO QIAN (CN)
HU YUSHI (CN)
LU ZHENYU (CN)
XIAO LIHONG (CN)
CHEN JUN (CN)
DAI XIAOWANG (CN)
LYU JIN (CN)
ZHU JIFENG (CN)
DONG JINWEN (CN)
YAO LAN (CN)
Application Number:
PCT/CN2018/090426
Publication Date:
December 12, 2019
Filing Date:
June 08, 2018
Export Citation:
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Assignee:
YANGTZE MEMORY TECH CO LTD (CN)
International Classes:
H01L29/788
Foreign References:
US20120299082A12012-11-29
US20120280298A12012-11-08
US20160005760A12016-01-07
US20120299005A12012-11-29
US20150008506A12015-01-08
Attorney, Agent or Firm:
NTD UNIVATION INTELLECTUAL PROPERTY AGENCY LTD. (CN)
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