METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, PHOTOSENSITIVE RESIN COMPOSITION FOR PROJECTION EXPOSURE AND PHOTOSENSITIVE ELEMENT

WIPO Patent Application WO/2015/177947

A1

The purpose of the present invention is to provide a method for forming a resist pattern, which is capable of forming a resist pattern that has a good resist shape and is reduced in the formation of resist skirts, while having improved adhesion and aspect ratio. The present invention provides a method for forming a resist pattern, which comprises: a step for forming a photosensitive resin layer on a substrate with use of a photosensitive resin composition for projection exposure; a step for exposing the photosensitive resin layer to light via a lens with use of active light projecting the image of a photomask; and a step for removing the unexposed portions of the photosensitive resin layer from the substrate by means of development. The photosensitive resin composition for projection exposure contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond and (C) a photopolymerization initiator. The photosensitive resin layer has a light transmittance of from 58.0% to 95.0% (inclusive) at a wavelength of 365 nm.

KUME MASAKAZU (JP)
MUNAKATA MOMOKO (JP)

PCT/JP2014/083421

November 26, 2015

December 17, 2014

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HITACHI CHEMICAL CO LTD (JP)

G03F7/004; G03F7/031; H05K3/06; H05K3/18

WO2012081680A1	2012-06-21
WO2012137838A1	2012-10-11

JP2009145613A	2009-07-02
JP2003098663A	2003-04-04
JP2002023383A	2002-01-23

HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)

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