METHOD OF FUSING HOLLOW BOARD OF SYNTHETIC RESIN AND HOLLOW BOARD OBTAINED BY SAME

Title:

METHOD OF FUSING HOLLOW BOARD OF SYNTHETIC RESIN AND HOLLOW BOARD OBTAINED BY SAME

Document Type and Number:

WIPO Patent Application WO/1997/018079

Kind Code:

A1

Abstract:

An ultrasonic fusion apparatus is used for joining of a unitary thermoplastic resin extruded board (B), in which a first sheet (2a) and a second sheet (2b) are connected to each other through a multiplicity of parallel webs (3). In order to fuse the first sheet (2a) and the second sheet (2b) to each other in a linear or surface-like manner, an ultrasonic oscillation unit (6) of the ultrasonic fusion apparatus is made to abut against a surface of the first sheet (2a), and a seat portion (7) is made to abut against a surface of the second sheet (2b), so that the board (B) is pressed between the oscillation unit (6) and the seat portion (7). In order to join boards (B1, B2) to each other, both boards are made to at least partially overlap each other, ultrasonic waves are generated while an oscillation unit (6C) and a seat portion (7C) press both sides of both boards. Ultrasonic waves cause internal oscillation in the boards, and friction due to the oscillation generates heat from inside, so that fusion is effected by the fusing and the pressing forces.

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Inventors:

SAITOH TSUYOSHI (JP)
HAGIWARA KENJIRO (JP)
SASAKI HISASHI (JP)

Application Number:

PCT/JP1996/003318

Publication Date:

May 22, 1997

Filing Date:

November 12, 1996

Export Citation:

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Assignee:

KISHIMOTO SANGYO CO (JP)
UNITEK CO LTD (JP)
SAITOH TSUYOSHI (JP)
HAGIWARA KENJIRO (JP)
SASAKI HISASHI (JP)

International Classes:

B29C53/06; B29C63/00; B29C65/00; B29C65/02; B29C65/74; B29C67/00; B32B3/00; B32B3/12; B32B3/28; E04C2/54; B29C65/08; (IPC1-7): B29C65/08; B32B3/12

Foreign References:

JPS5971817A	1984-04-23
JPS597014A	1984-01-14
JPS52101194A	1977-08-24
JPH07100934A	1995-04-18

Other References: