Title:
METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR BONDING BODIES TO BE BONDED
Document Type and Number:
WIPO Patent Application WO/2023/190573
Kind Code:
A1
Abstract:
This method for manufacturing a bonded body manufactures a bonded body in which a first body (11) to be bonded and a second body (13) to be bonded are bonded with a bonding layer interposed therebetween. A paste containing copper particles and an organic solvent is applied to the first body (11) to be bonded to form a coating film (12X). The second body (13) to be bonded is placed on the coating film (12X) to form a laminate (15). The laminate (15) is heated and pressed to sinter the copper particles in the coating film (12X) and thereby form the bonding layer. The heating is gradual from the heating start temperature until the maximum temperature Tm is reached, while the pressing is gradual from the pressing start pressure until the maximum pressure Pm is reached, wherein the pressure at the time when the heating temperature reaches 200°C is 15 MPa or less.
Inventors:
HATTORI TAKASHI (JP)
YAMAUCHI SHINICHI (JP)
ANAI KEI (JP)
YAMAUCHI SHINICHI (JP)
ANAI KEI (JP)
Application Number:
PCT/JP2023/012630
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
H01L21/52; B22F7/08; B22F9/00
Domestic Patent References:
| WO2022210477A1 | 2022-10-06 |
Foreign References:
| JP2020164894A | 2020-10-08 | |||
| JP2017164782A | 2017-09-21 |
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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