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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING CHIP INDUCTOR HAVING FINE-PITCH LINE WIDTH AND PHOTOSENSITIVE MATERIAL USED THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/066468
Kind Code:
A1
Abstract:
The present invention relates to a method for manufacturing a laminated chip inductor having a fine-pitch line width and, more particularly, to a method for manufacturing a laminated chip inductor having a plurality of electrode patterns laminated with a dielectric material layer interposed therebetween, wherein a process of forming the electrode patterns is performed by applying photosensitive conductor paste and then forming patterns through a photolithography process; a process of forming the dielectric material layer is performed by applying photosensitive dielectric material paste over the electrode patterns and then forming via-holes connected to the electrode patterns through a photolithography process; and, in the process of applying the photosensitive conductor paste, the photosensitive conductor paste fills the via-holes formed in the dielectric material layer, thereby electrically connecting the lower electrode pattern and the upper electrode pattern to each other. The present invention is advantageous in that, by using a photosensitive conductor material and a photosensitive dielectric material, it is possible to manufacture a laminated chip inductor that is more precise and has excellent durability and stability.

Inventors:
PARK CHANSEOK (KR)
PAEK SINHYE (KR)
JUNG ILHO (KR)
Application Number:
PCT/KR2018/011385
Publication Date:
April 04, 2019
Filing Date:
September 27, 2018
Export Citation:
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Assignee:
INNOCIA CO LTD (KR)
International Classes:
H01L49/02; G03F7/00; G03F7/028; G03F7/039; H01L21/027
Foreign References:
KR20060013950A2006-02-14
KR20030006639A2003-01-23
KR20090094867A2009-09-08
KR20060000784A2006-01-06
JP2003022924A2003-01-24
Attorney, Agent or Firm:
DAWOOL PATENT AND LAW FIRM (KR)
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