Title:
METHOD FOR MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/175963
Kind Code:
A1
Abstract:
A method for manufacturing a circuit board that has both a high adhesive property and excellent high frequency characteristics is provided. Provided is a method for manufacturing a circuit board, the circuit board comprising a high frequency circuit that includes a base material, a ground layer, and a signal layer, at least the signal layer being a layer derived from a copper foil, the method comprising: (a) a step for, on the assumption of manufacturing a high frequency circuit using a copper foil having no adhesive agent layer, designing the specifications of a high frequency circuit having a predetermined impedance Z1; and (b) a step for forming a high frequency circuit in accordance with the specifications with the exception that the signal layer is formed by using, instead of the copper foil having no adhesive agent layer as assumed in the specifications, an adhesive agent layer-attached copper foil in such a way that an adhesive agent layer is interposed between the base material and the signal layer, to thereby manufacture a circuit board with the high frequency circuit having an impedance Z2 greater than Z1.
Inventors:
ONO HIROSHI (JP)
OSAWA KAZUHIRO (JP)
TAKAHASHI KEI (JP)
OSAWA KAZUHIRO (JP)
TAKAHASHI KEI (JP)
Application Number:
PCT/JP2022/012826
Publication Date:
September 21, 2023
Filing Date:
March 18, 2022
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
H05K1/02; H05K3/00
Foreign References:
| JP2017130658A | 2017-07-27 | |||
| JP2000091466A | 2000-03-31 | |||
| JPH04293170A | 1992-10-16 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
Download PDF: