METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE AND COMPOSITE SUBSTRATE

WIPO Patent Application WO/2021/220737

A1

Provided are a composite substrate capable of improving temperature characteristics while suppressing the generation of cracks and a method for manufacturing the composite substrate.　The method according to the present invention for manufacturing a composite substrate comprises: a step for preparing a piezoelectric material substrate having a rough surface; a step for etching the rough surface of the piezoelectric material substrate by a chemical means and thus removing a damaged layer; a step for depositing an intermediate layer on the rough surface of the piezoelectric material substrate from which the damaged layer has been removed; a step for planarizing the surface of the intermediate layer thus deposited; a step for bonding the piezoelectric material substrate, via the deposited intermediate layer, to a support substrate that has a smaller coefficient of thermal expansion than the piezoelectric material; and a step for thinning the piezoelectric material substrate after bonding. As the piezoelectric material, lithium tantalate (LT) or lithium niobate (LN) is preferred.

AKIYAMA SHOJI (JP)

PCT/JP2021/014658

November 04, 2021

April 06, 2021

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SHINETSU CHEMICAL CO (JP)

C30B33/00; C30B29/30; C30B33/06; C30B33/10; C30B33/12; H01L21/02; H03H3/08; H03H9/25

WO2018088093A1	2018-05-17
WO2009081651A1	2009-07-02

JPS55109015A	1980-08-21
JPH0738363A	1995-02-07
JP6250856B1	2017-12-20

"Temperature Compensation Technology for SAW-Duplexer Used in RF Front End of Smartphone", DEMPA SHIMBUN HIGH TECHNOLOGY, 8 November 2012 (2012-11-08)

ORISAKA Shigeki (JP)

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