Title:
METHOD FOR MANUFACTURING CUT FILM
Document Type and Number:
WIPO Patent Application WO/2024/024546
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a cut film that allows it to be easily determined whether or not a cutting process has been executed normally. A method for manufacturing a cut film according to an embodiment of the present invention comprises a step for cutting resin film with a milling tool, wherein the milling tool is controlled so that its rotational speed is constant during the resin film cutting step, and a current value required to drive the milling tool is monitored.
Inventors:
HIRAOKA SHINYA (JP)
ISHII TAKAAKI (JP)
ISHII TAKAAKI (JP)
Application Number:
PCT/JP2023/026065
Publication Date:
February 01, 2024
Filing Date:
July 14, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B23C3/12; B23C5/10; B23Q17/09; C09J7/38; G02B5/30; G02F1/13; H05B33/02; H05B33/14; H10K50/10; H10K59/00
Domestic Patent References:
| WO2016067384A1 | 2016-05-06 |
Foreign References:
| JP2021047307A | 2021-03-25 | |||
| JPH04269153A | 1992-09-25 | |||
| JP2020134582A | 2020-08-31 | |||
| JP2019020648A | 2019-02-07 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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