Title:
METHOD FOR MANUFACTURING DIELECTRIC LAYER, RESIN COMPOSITION, AND LAMINATE INCLUDING DIELECTRIC LAYER
Document Type and Number:
WIPO Patent Application WO/2022/131298
Kind Code:
A1
Abstract:
The manufacturing method according to the present disclosure is for manufacturing a dielectric layer provided to a reflective electromagnetic wave absorber, the method including: a step for preparing a resin composition that contains at least one type of dielectric compound and a resin component, and that has a relative dielectric constant higher than 10.0 at a frequency of 3.7 GHz or 90 GHz; and a step for forming a dielectric layer having a thickness of 20-7000 µm that is formed from the resin composition. The resin composition according to the present disclosure is used in the formation of a dielectric layer provided to a reflective electromagnetic wave absorber, the resin composition containing at least one type of dielectric compound and a resin component, and having a relative dielectric constant higher than 10.0 at a frequency of 3.7 GHz or 90 GHz.
Inventors:
NISHIYAMA HIROYOSHI (JP)
SHODA RYO (JP)
SHODA RYO (JP)
Application Number:
PCT/JP2021/046304
Publication Date:
June 23, 2022
Filing Date:
December 15, 2021
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
H05K9/00; B32B27/00; H01G4/00; H01G4/06; H01G4/20; H01G4/33
Foreign References:
| JP2020161584A | 2020-10-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: