METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT

Title:

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2023/248890

Kind Code:

A1

Abstract:

This method for manufacturing an electronic component is characterized by including a press step for clamping a lead terminal extending from an electrical element with a pair of press dies along the longitudinal direction, and processing the lead terminal into a plate shape, wherein in at least one of the pair of press dies, a blast process is performed on a surface in contact with the lead terminal so that protrusions and recesses are randomly formed on the plate surface of the lead terminal.　

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JP2004241455	ANODE FOR SOLID ELECTROLYTIC CAPACITOR, ITS MANUFACTURING METHOD AND SOLID ELECTROLYTIC CAPACITOR USING THE SAME

Inventors:

YONETA KEISUKE (JP)
KIMURA NAOZUMI (JP)

Application Number:

PCT/JP2023/022070

Publication Date:

December 28, 2023

Filing Date:

June 14, 2023

Export Citation:

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Assignee:

ELNA CO LTD (JP)

International Classes:

H01G9/00; H01G4/228; H01G9/008; H01G13/00

Foreign References:

JP2018061015A	2018-04-12
JP2003007948A	2003-01-10
JP2001077286A	2001-03-23
JP2000012386A	2000-01-14

Attorney, Agent or Firm:

KATAYAMA, Shuhei (JP)

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