Title:
METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/016206
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a flexible semiconductor device. The manufacturing method is characterized by comprising (i) a step of forming an insulating film on the upper surface of a resin film, (ii) a step of forming an extraction electrode pattern on the upper surface of the resin film, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the extraction electrode pattern, and (iv) a step of forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, wherein at least one forming step among the above (i) to (iv) is performed by a printing method. In the manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.
Inventors:
HIRANO KOICHI
NAKATANI SEIICHI
OGAWA TATSUO
NAKATANI SEIICHI
OGAWA TATSUO
Application Number:
PCT/JP2009/003615
Publication Date:
February 11, 2010
Filing Date:
July 30, 2009
Export Citation:
Assignee:
PANASONIC CORP (JP)
HIRANO KOICHI
NAKATANI SEIICHI
OGAWA TATSUO
HIRANO KOICHI
NAKATANI SEIICHI
OGAWA TATSUO
International Classes:
H01L29/786; H01L21/336; H01L51/05
Domestic Patent References:
| WO2009063583A1 | 2009-05-22 | |||
| WO2009069248A1 | 2009-06-04 |
Foreign References:
| JP2003258264A | 2003-09-12 | |||
| JP2005123290A | 2005-05-12 | |||
| JP2005166742A | 2005-06-23 | |||
| JP2006269475A | 2006-10-05 | |||
| JP2007073857A | 2007-03-22 |
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (JP)
Mitsuo Tanaka (JP)
Mitsuo Tanaka (JP)
Download PDF: