Title:
METHOD FOR MANUFACTURING HERMETIC-SEALING LID MEMBER, HERMETIC-SEALING LID MEMBER, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT STORING PACKAGE
Document Type and Number:
WIPO Patent Application WO/2016/093021
Kind Code:
A1
Abstract:
This method for manufacturing a hermetic-sealing lid member (1, 201, 301) is provided with: a step of forming a Ni-plated metal plate (70, 170) by forming a Ni-plated layer (11, 12, 41) on a surface of a metal plate (40) having corrosion resistance; and a step of forming a hermetic-sealing lid member by subjecting the Ni-plated metal plate to a punching process.
Inventors:
YOKOTA MASAYUKI (JP)
YAMAMOTO MASAHARU (JP)
YAMAMOTO MASAHARU (JP)
Application Number:
PCT/JP2015/082189
Publication Date:
June 16, 2016
Filing Date:
November 17, 2015
Export Citation:
Assignee:
NEOMAX MATERIALS CO LTD (JP)
HITACHI METALS LTD (JP)
HITACHI METALS LTD (JP)
International Classes:
H03H3/02; H01L23/02; H03H9/02
Domestic Patent References:
| WO2014073665A1 | 2014-05-15 |
Foreign References:
| JP2004186995A | 2004-07-02 | |||
| JPH05275603A | 1993-10-22 | |||
| JPS63104721A | 1988-05-10 | |||
| JP2000236035A | 2000-08-29 | |||
| JP2004342971A | 2004-12-02 |
Other References:
See also references of EP 3232568A4
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
Hirokazu Miyazono (JP)
Hirokazu Miyazono (JP)
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